Single or multi chip module package and related methods

ABSTRACT

A method of forming a semiconductor device package. Implementations may include providing an adhesive tape; contacting at least one electrical contact of at least one die with an adhesive surface of the adhesive tape; mechanically and electrically coupling at least one clip with the at least one die and contacting an electrical contact of the at least one clip with the adhesive surface; one of overmolding and encapsulating the at least one die and a majority of the at least one clip with one of a mold compound and an encapsulating compound, respectively, wherein the at least one electrical contact of the at least one die and the electrical contact of the at least one clip are not one of overmolded and encapsulated, forming the semiconductor device package; removing the semiconductor device package from the adhesive surface; and including no leadframe in the package.

BACKGROUND

1. Technical Field

Aspects of this document relate generally to semiconductor devicepackaging.

2. Background Art

Semiconductor devices are often encased within (or partly within) apackage prior to use. Some packages contain a single die while otherscontain multiple die. The package often offers some protection to thedie, such as from corrosion, impact and other damage, and often alsoincludes electrical leads or other components which connect theelectrical contacts of the die with a motherboard. The package may alsoinclude components configured to dissipate heat from the die into amotherboard or otherwise away from the package.

SUMMARY

Implementations of a method of forming a semiconductor device packagemay include: providing an adhesive tape; contacting at least oneelectrical contact of at least one die with an adhesive surface of theadhesive tape; mechanically and electrically coupling at least one clipwith the at least one die and contacting an electrical contact of the atleast one clip with the adhesive surface; one of overmolding andencapsulating the at least one die and a majority of the at least oneclip with one of a mold compound and an encapsulating compound,respectively, wherein the at least one electrical contact of the atleast one die and the electrical contact of the at least one clip arenot one of overmolded and encapsulated, forming the semiconductor devicepackage; and removing the semiconductor device package from the adhesivesurface; wherein the at least one electrical contact of the at least onedie and the electrical contact of the at least one clip are positionedto electrically couple with one or more conductive paths on amotherboard, the one or more conductive paths forming a distributionlayer; and wherein the distribution layer is configured to distributeall electrical signals between the semiconductor device package and themotherboard.

Implementations of a method of forming a semiconductor device packagemay include: providing an adhesive tape; contacting a plurality ofelectrical contacts on a first face of a first die with an adhesivesurface of the adhesive tape; one of overmolding and encapsulating thefirst die with one of a mold compound and an encapsulating compound,respectively, wherein a portion of the plurality of electrical contactson the first face of the first die are not one of overmolded andencapsulated, forming the semiconductor device package; and removing thesemiconductor device package from the adhesive surface; wherein theportion of the plurality of electrical contacts on the first face of thefirst die are positioned to electrically couple with one or moreconductive paths on a motherboard, the one or more conductive pathsforming a distribution layer; and wherein the distribution layer isconfigured to distribute all electrical signals between thesemiconductor device package and the motherboard.

Implementations of a method of forming a semiconductor device packagemay include one, all, or any of the following:

Contacting at least one electrical contact on a first face of a seconddie with the adhesive surface; mechanically and electrically coupling afirst clip with an electrical contact on a second face of the second diewhere the second face of the second die is on an opposing side of thesecond die from the first face of the second die; contacting anelectrical contact of the first clip with the adhesive surface; and oneof overmolding and encapsulating the second die and a majority of thefirst clip with the one of the mold compound and encapsulating compound,respectively, wherein the at least one electrical contact on the firstface of the second die and the electrical contact of the first clip arenot one of overmolded and encapsulated.

The first clip may be one of bonded and soldered to the second face ofthe second die.

The distribution layer may be configured to distribute all electricalcommunications between the first die and the second die.

Contacting at least one electrical contact on a first face of a thirddie with the adhesive surface; mechanically and electrically coupling asecond clip with an electrical contact on a second face of the thirddie, the second face of the third die on an opposing side of the thirddie from the first face of the third die; contacting an electricalcontact of the second clip with the adhesive surface; and one ofovermolding and encapsulating the third die and a majority of the secondclip with the one of the mold compound and encapsulating compound,respectively, wherein the at least one electrical contact on the firstface of the third die and the electrical contact of the second clip arenot one of overmolded and encapsulated.

The distribution layer may be configured to distribute all electricalcommunications between the first die, the second die and the third die.

The second clip may be positioned to electrically couple the second diewith the third die through the one or more conductive paths included inthe motherboard.

The electrical contact of the second clip may be positioned toelectrically couple with the one or more conductive paths included inthe motherboard.

The semiconductor device package may include no wire bonds.

The semiconductor device package may include no leadframe.

The distribution layer may be configured to distribute a majority ofelectrical signals between the plurality of electrical contacts on thefirst face of the first die.

Coupling the semiconductor device package with the motherboard.

Implementations of a method of forming a semiconductor device packagemay include: providing an adhesive tape; contacting a plurality ofelectrical contacts on a first face of a first die or a passivecomponent with an adhesive surface of the adhesive tape; one ofovermolding and encapsulating the first die or the passive componentwith one of a mold compound and an encapsulating compound, respectively,wherein a portion of the plurality of electrical contacts on the firstface of the first die or the passive component are not one of overmoldedand encapsulated, forming the semiconductor device package, thesemiconductor device package including no leadframe; and removing thesemiconductor device package from the adhesive surface; wherein theportion of the plurality of electrical contacts on the first face of thefirst die or the passive component are positioned to electrically couplewith one or more conductive paths included in a motherboard, the one ormore conductive paths forming a distribution layer; and wherein thedistribution layer is configured to distribute all electrical signalsbetween the semiconductor device package and the motherboard.

Implementations of a method of forming a semiconductor device packagemay include one, all, or any of the following:

The semiconductor device package may include no wire bonds.

Implementations of a method of forming a semiconductor device packagemay include: providing an adhesive tape; contacting a plurality ofelectrical contacts on a first face of a die with an adhesive surface ofthe adhesive tape; electrically and mechanically coupling at least oneclip with at least one electrical contact on a second face of the die,the second face of the die on an opposing side of the die from the firstface of the die, the at least one clip including at least one lead inelectrical communication with the at least one electrical contact on thesecond face of the die; contacting the at least one lead with theadhesive surface; one of overmolding and encapsulating the die and amajority of the at least one clip with one of a mold compound and anencapsulating compound, respectively, wherein a portion of the at leastone lead and a portion of the plurality of electrical contacts on thefirst face of the die are not one of overmolded and encapsulated,forming the semiconductor device package; and removing the semiconductordevice package from the adhesive surface.

Implementations of a method of forming a semiconductor device packagemay include one, all, or any of the following:

The plurality of electrical contacts on the first face of the die mayinclude one of pads and bumps.

The semiconductor device package may include no wire bonds.

The semiconductor device package may include no leadframe.

Mechanically coupling the at least one clip with the at least oneelectrical contact on the second face of the die may further include oneof bonding and soldering the at least one clip with the at least oneelectrical contact on the second face of the die.

The foregoing and other aspects, features, and advantages will beapparent to those artisans of ordinary skill in the art from theDESCRIPTION and DRAWINGS, and from the CLAIMS.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations will hereinafter be described in conjunction with theappended drawings, where like designations denote like elements, and:

FIG. 1 is a top perspective view of two implementations of die of asemiconductor device package;

FIG. 2 is a top perspective view of three implementations of die of asemiconductor device package adhered to an adhesive surface of anadhesive tape;

FIG. 3 is a bottom perspective view of the die and adhesive tape of FIG.2 with the adhesive tape drawn in see-through fashion so that the bottomsurfaces of the die may be viewed;

FIG. 4 is a top perspective view of an implementation of a semiconductordevice package with the mold compound drawn in see-through fashion sothat other elements may be viewed;

FIG. 5 is a bottom perspective view of the semiconductor device packageof FIG. 4 with the mold compound drawn in see-through fashion so thatother elements may be viewed;

FIG. 6 is a top perspective view of the semiconductor device package ofFIG. 4 adhered to an adhesive surface of an adhesive tape with the moldcompound drawn in opaque fashion;

FIG. 7 is a bottom perspective view of the semiconductor device packageof FIG. 5 with the mold compound drawn in opaque fashion;

FIG. 8 is a top perspective view of the semiconductor device package ofFIG. 4 and a plurality of conductive paths of a motherboard, with themold compound drawn in see-through fashion so that other elements may beviewed;

FIG. 9 is a top perspective view of a motherboard with conductive paths,with a dashed outline showing the location of a semiconductor devicepackage on the motherboard;

FIG. 10 is a top see-through view of a semiconductor device packageshowing only the mold compound and various contacts on the bottom of thesemiconductor device package;

FIG. 11 is a top view of a distribution layer of a motherboard;

FIG. 12 is a top perspective view of elements of an implementation of asemiconductor device package adhered to an adhesive surface of anadhesive tape; and

FIG. 13 is a top perspective view of an implementation of asemiconductor device package.

DESCRIPTION

This disclosure, its aspects and implementations, are not limited to thespecific components, assembly procedures or method elements disclosedherein. Many additional components, assembly procedures and/or methodelements known in the art consistent with the intended semiconductordevice packages and related methods will become apparent for use withparticular implementations from this disclosure. Accordingly, forexample, although particular implementations are disclosed, suchimplementations and implementing components may comprise any shape,size, style, type, model, version, measurement, concentration, material,quantity, method element, step, and/or the like as is known in the artfor such semiconductor device packages and related methods, andimplementing components and methods, consistent with the intendedoperation and methods.

Referring now to FIGS. 1-11, in implementations a semiconductor devicepackage 2 includes one or more semiconductor die (die) 6, 12, 20, and/or34, one or more clips 46 and/or 50, and a mold compound (encapsulatingcompound) 54. Referring to FIGS. 12-13, in various implementations asemiconductor device package 56 includes a semiconductor die (die) 58,one or more clips 66 and/or 70 having leads 68 and/or 72, and a moldcompound (encapsulating compound) 74.

Referring now to FIGS. 1 and 2, implementations of semiconductorpackages disclosed herein are formed using implementations of a methodof forming a semiconductor device package 2. The method 2 includesplacing a die 12 on an adhesive surface 64 of an adhesive tape (moldtape) 62. Die 12 includes a plurality of electrical contacts 18 on afirst face 14. The electrical contacts 18 on the die 12 shown in thedrawings are bumps (stud bumps). In implementations a semiconductordevice package could include a die 6 which is generally similar, or insome cases identical, to die 12, except that the electrical contacts 10on the first face 8 of die 6 are pads instead of bumps.

In implementations a semiconductor device package may include only asingle die, as in the semiconductor device package 56 of FIG. 13, forexample, which includes (referring to FIG. 12) only a single die 58. Inimplementations of making such a package, the method includes placingthe single die 58 so that electrical contacts on a first face of the die58 contact the adhesive surface 64 of the adhesive tape 62. A clip 66 ismechanically and electrically coupled to one or more electrical contactson a second face 60 of the die 58 and placed so that leads 68 of theclip 66 contact the adhesive surface 64. The second face 60 of the die58 is on an opposing side of the die 58 from the first face of the die58. In the implementation shown a clip 70 is also included which ismechanically and electrically coupled to one or more electrical contactson the second face 60 of the die 58 and placed so that a lead 72 of theclip 70 contacts the adhesive surface 64. In other implementations onlya single clip could be used instead of a clip 66 and a clip 70 and/orthe clip(s) could have different configurations—for instance thesemiconductor device package could contain more or less leads such asone, two, three, five, six, seven, or more leads. In the implementationshown if FIGS. 12-13 the leads are gull-wing leads but in otherimplementations they could have any other shape and configuration, forinstance the package could be formed so that the leads 68, 72 aresubstantially flush with the outer faces of the package to form a flatno-leads package. Additionally, in the implementation shown in FIGS.12-13 all of the leads exit the same side face of the semiconductordevice package 56 but, in other implementations, the clips could beconfigured so that the leads exit two opposing side faces (such as, bynon-limiting example, to form a dual in-line package (DIP or DIL)), orso that the leads exit three side faces, or so that the clips exit fourside faces (such as, by non-limiting example, to form a quad flatpackage (QFP)).

In various implementations a semiconductor device package may include aplurality of die. Referring to FIG. 2, a die 12 is positioned so thatelectrical contacts 18 on a first face 14 of the die 12 contact theadhesive surface 64, a die 20 is positioned so that contact 26 andelectrical contacts 28 and 30 on a first face 22 of the die 20 contactthe adhesive surface 64, and die 34 is positioned so that contact 40 andelectrical contact 42 on a first face 36 of the die 34 contact theadhesive surface 64. Contacts 26 and 40 in the implementations shown areelectrical contacts, though in implementations they could beadditionally or alternatively heat sinks and/or other heat transferstructures/devices could be located on the first faces 14, 22, 36 totransfer heat from the die to a motherboard.

Die 20 includes an electrical contact 32 on a second face 24 which is onan opposing side of the die 20 from the first face 22. Die 34 includesan electrical contact 44 on a second face 38 which is on an opposingside of the die 34 from the first face 36. Die 12 has a second face 16which is on an opposing side of the die 12 from the first face 14. Inthe implementations shown there are no electrical contacts on the secondface 16 of die 12 (and in fact all of the electrical contacts of the die12 are on the first face 22), though in other implementations the secondface 16 could include electrical contacts and/or one or more or all ofthe side faces of the die 12 could include electrical contacts and/orheat sinks to allow external elements such as clips to electricallyand/or mechanically couple thereto to allow communication between theintegrated circuit (IC) elements of the die 12 with other elements.Similarly, although only one electrical contact (32 or 44) is shown onthe second face (23 or 38) of each of die 20 and 34, respectively, inother implementations a plurality of electrical contacts and/or heatsinks could be present on those faces and/or on other faces of thosedie.

FIG. 4 shows clips 46 and 50 electrically coupled to die 20 and 34,respectively. Clip 46 is mechanically and electrically coupled to one ormore electrical contacts (for example electrical contact 32) on thesecond face 24 and clip 50 is mechanically and electrically coupled toone or more electrical contacts (for example electrical contact 44) onthe second face 38. Clip 46 may also be mechanically coupled, generally,to the second face 24 and clip 50 may also be mechanically coupled,generally, to the second face 38. The mechanical and electrical couplingmay be accomplished, by non-limiting example, by a soldering process orby an adhesive process such as with an electrically conductive adhesive.Referring to FIG. 5, clip 46 has an electrical contact 48 which contactsthe adhesive surface 64 and clip 50 has an electrical contact 52 whichcontacts the adhesive surface 64. After the clips are placed and aremechanically and electrically coupled to the electrical contacts of therespective die, a mold or encapsulating compound 54 is overmolded orencapsulated over the various elements in a liquid form and allowed tosolidify. In implementations a single unit of compound 54 may be placedover a single group of elements to form a single semiconductor devicepackage 2, for example as shown in FIGS. 4-8 (such as in punchsingulation), though in other implementations a plurality ofsemiconductor device packages 2 could be formed on a single piece ofadhesive tape 62 for example by placing down on the adhesive surface 64a multitude of die and clips, overmolding or encapsulating the multitudeof die and clips and then cutting or otherwise singulating eachindividual package 2 through a cutting, sawing or other separationprocess.

In various implementations, the mold/encapsulating compound 54 isovermolded or placed so that it covers all of the elements of thepackage 2 except for a plurality of contacts on a first face 4 of thepackage 2. Referring to FIG. 7, for instance, the package 2 only haselectrical contacts on a first face 4 of the package 2 which, after theovermolding or encapsulating process, is facing the adhesive surface 64.The package 2 is then removed from the adhesive surface 64 to reveal orotherwise expose the contacts. The FIG. 7 implementation of package 2shows that the following contacts are exposed through the first face 4of the package 2: contacts 40 and 28 (which in the implementations shownare electrical contacts but which in other implementations mayadditionally or alternatively be heat sinks), electrical contacts 28,30, 42, 48, 52, and a number of electrical contacts 18 (not all of theelectrical contacts 18 are numbered in the drawings but all of them havethe same general shape, as all are bumps in the representative example).The package 2 thus may be a flat no-leads package. In various methodimplementations, a package could similarly be formed into a quad flatno-leads package (QFN) configuration, a dual flat no leads (DFN) packageconfiguration, a micro leadframe (MLP) configuration, a small-outline noleads (SON) configuration, and many other package types.

For a package which includes no leads, such as package 2, theovermolding or encapsulating process may include encapsulating orovermolding the elements of the package 2 except for the first faces ofthe die which are facing the adhesive surface 64 (such as the firstfaces 8, 14, 22, 36), and overmolding a majority of the clips (or all ofthe clips except for the electrical contacts 48, 52) while leaving thecontacts and electrical contacts of the first faces 8, 14, 22 and/or 36exposed. The overmolding or encapsulating process may alternativelyinclude overmolding or encapsulating a portion of the first faces 8, 14,22 and/or 36 but without overmolding or encapsulating the electricalcontacts on the first faces 8, 14, 22 and/or 36 (for example if thecontacts/electrical contacts include pads or stud bumps which extendsufficiently outwards from the first faces 8, 14, 22 and/or 36 such aprocess may be utilized to cover the first faces 8, 14, 22 and/or 36except for the contacts/electrical contacts).

For a package which includes leads, such as package 56, the overmoldingor encapsulating process may similarly include encapsulating orovermolding the elements of the package 56 except for the first face ofdie 58 (which is on an opposing side of the die 58 from a second face 60of the die 58), and overmolding a majority of the clips 66, 70 whileleaving the leads 68, 72 and the electrical contacts on the first faceof the die 58 exposed. The overmolding or encapsulating process mayalternatively include overmolding or encapsulating a portion of thefirst face of the die 58 but without overmolding or encapsulating theelectrical contracts on the first face of the die 58, similar to theprocess described above for package 2.

Thus, in various implementations the contacts and electrical contacts ofthe die and clips are not overmolded and are not encapsulated in theovermolding/encapsulating process. The overmolding or encapsulatingcompounds 54, 74 may be, or may include, by non-limiting example, athermosetting or thermoplastic polymer, a thermosetting resin, an epoxyresin, and other polymeric or composite flowable materials.

In the implementations illustrated, all of the electrical (and any heatsink) contacts of the package 2 are exposed only through the first face4. In other implementations a semiconductor device package could have,additionally, electrical and/or heat sink contacts exposed through anyother face of the package and/or may include leads extendingsubstantially past a face so that they are substantially not flush withthe face, similar to how the leads 68/72 of package 56 extendsubstantially past the side face from which they exit so that they arenot substantially flush with the side face. In contrast, all of thecontacts and electrical contacts shown in the FIG. 7 implementation ofpackage 2 are at least substantially flush with the first face 4 ofpackage 2.

As shown in FIGS. 7-11, the electrical contacts shown in FIG. 7 areconfigured to align with conductive paths 78 on an upper face 80 of amotherboard 76. FIG. 9 is a top perspective view of a motherboard 76with conductive paths 78, with a dashed outline showing the location ofthe package 2 on the motherboard 76. FIG. 10 is a top see-through viewof a semiconductor device package similar to package 2 but whichincludes die 6 in place of die 12, the figure showing only the moldcompound 54, contacts 26, 40 and electrical contacts 10, 26, 28, 30, 42,48, 52. FIG. 11 shows a top view of a distribution layer 82 of amotherboard 76 including the conductive paths 78 located on the upperface 80, the distribution layer 82 configured to electrically coupleeach of the contacts and electrical contacts shown in FIG. 10 to atleast one conductive path 78. The practitioner may envision how thecontacts/electrical contacts shown in FIG. 10 align with the conductivepaths 78 of FIG. 11 when the package is placed on the motherboard 76.The contacts and electrical contacts of the package 2/56 may beelectrically and mechanically coupled to the conductive paths 78 of thedistribution layer 82, by non-limiting example, using a solderingprocess or by an adhesion process such as with an electricallyconductive adhesive.

As can be seen in FIG. 8, in implementations one or more of the clipsmay be configured to couple die together through the motherboard 76.Clip 50 of FIG. 8 is shown electrically coupling die 34 with die 20through one of the conductive paths 78.

In implementations package 2 includes a driver metal-oxide-semiconductorfield-effect transistor (DrMOS). The package 2 may be configured toperform high-current DC-DC buck power conversion applications. Inimplementations package 2 includes a metal-oxide-semiconductorfield-effect transistor (MOSFET) driver, a high-side MOSFET (HS-FET) anda low-side MOSFET (LS-FET). Die 6/12 may be a driver and may have a sizeof, or of about, 0.86 mm by 0.94 mm by 0.2032 mm. Die 20 may be a HS-FETand may have a size of, or of about, 1.55 mm by 1.22 mm by 0.106 mm. Die34 may be a LS-FET and may have a size of, or of about, 1.44 mm by 1.33mm by 0.1016 mm. Clips 46 and 50 may be formed clips each having athickness of, or of about, 0.125 mm. Molding/encapsulation compound 54may be, or may include, an epoxy resin sold under the trade name G770SERIES and/or G770HCD by Sumitomo Bakelite Co., Ltd. of Tokyo, Japan.Solder used to couple elements of the package 56 together may be, or mayinclude, an 85 wt % tin 15 wt % lead (SnPb 85/15) solder, or any othersolder. Package 2 may have a size of, or of about, 3 mm by 3 mm by 0.5mm.

In other implementations package 56 is a small outline 8-pin flat leads(SO8FL) package that includes no wire bonds and no leadframe. Die 58 maybe or may include a MOSFET. Package 56 may have a size of, or of about,6 mm by 5 mm by 0.5 mm. Die 58 may have a thickness of, or of about,0.2032 mm, though the thickness may vary depending on the application.Clips 66 and 70 may each have thickness of, or of about, 0.125 mm.Molding/encapsulation compound 74 may be, or may include, an epoxy resinsold under the trade name G770 SERIES and/or G770HCD by SumitomoBakelite Co., Ltd. Solder used to couple elements of the package 56together may be, or may include, an 85 wt % tin 15 wt % lead (SnPb85/15) solder, or any other solder. Package 56 may be sized to becoupled to a motherboard that is configured to receive a 6 mm by 5 mm by1 mm SO8FL package.

The adhesive tape 62 may be mold tape such as is currently used inmolding processes for semiconductor packages that include leadframes. Inimplementations the electrical contacts of the die and other componentsmay include copper pillars, bumps, pads and the like. These may becreated and/or attached to die and other components prior to theirplacement on the adhesive tape 62. The adhesive tape 62 may be a hightemperature tape that is held by a tape carrier (carrier ring) whiledie, discretes (capacitors, resistors, transistors, and any otherelectronic components each with just one circuit element, passive oractive, other than an integrated circuit) and other components areplaced, with electrical contacts down, on the adhesive tape 62. Soldermay then be applied to the top of the die or other components, then theclips may be positioned and the solder reflowed to electrically andmechanically attach the clips to the die and/or other components. Thearray may then be molded in a transfer mold using mold compound 54 or74. The molded array may be laser marked, and before or after lasermarking the array may be removed from the adhesive tape 62. Followinglaser marking and removal of the array from the adhesive tape 62 thearray may be sawed (saw singulation) or otherwise singulated using anyseparation technique. In implementations wherein a package isindependently formed (punch singulation) the same or similar steps maybe followed except for the sawing step which will be unnecessary.

In implementations a package after molding or encapsulating may leave aportion of one or more clips, or other components, exposed for therelease of heat and/or to attach a heat sink thereto. For example, thesides/faces of the clips corresponding with (i.e., parallel orsubstantially parallel with and facing the same or substantially thesame direction) the second faces 16, 24, 38, 60 of die may be exposed orpartially exposed, and/or one or more of the second faces 16, 24, 38and/or 60 themselves may be exposed or partially exposed, for thispurpose. One or more die, clips or other components may be exposed inthis manner for stacked package applications, i.e., package on package(PoP). In PoP implementations, leadframes, clips and/or wire bonds maybe used to accomplish stacking amongst packages. Die, discretes andother components may also be stacked face up or down with othercomponents within the package and/or may be used to bridge betweencomponents within a package and/or may or may not be exposed orpartially exposed after molding or encapsulating. Components within orpartially within a package such as those described herein may also beused to provide mechanical standoffs for the package relative to themotherboard or betwixt elements within the package. Methods such asthose disclosed herein may be utilized for stacking chips/die and/orpackages in system in package (SIP) modules.

In other implementations, no portion of the die(s) will be exposed afterthe molding or encapsulating process except for the portions on whichthe electrical contacts and/or heat sinks are present. Inimplementations one or more of the die, clips, or other elements may beformed such as to prevent or hinder the molding or encapsulatingcompound 54, 74 from tending to separate from the components within themolding or encapsulating compound 54, 74 (thus creating one or more moldlocks). In implementations in which a portion of the first face(s) 4, 8,14, 22, 36 and/or 58 is/are covered by the mold compound 54 or 74, asdiscussed herein, this may form one or more mold locks and inimplementations with sufficient stand-off height of the electricalcontacts there may be no exposed die surfaces in the finished package.In multichip module (MCM) packages any number and combination of die(s),field-effect transistors (FETs), clip(s), discrete(s), and/or othercomponents, and the like, may be used.

The adhesive tape 62 could be, by non-limiting example: a map moldingsupport tape sold under the trade name RT SERIES by Hitachi ChemicalCo., Ltd. of Tokyo, Japan; a heat resistant tape sold under the tradename PW/TRM series by Nitto Denko Corporation of Osaka, Japan; and thelike. In implementations the adhesive tape 62 may be or may include athick tape with low-force ultraviolet (UV) release adhesive and other UVrelease tape types of other thicknesses as well.

All of the contacts, electrical contacts and conductive paths discussedherein may be formed of metals, metallic alloys, or other generallyelectrically conductive materials, as opposed to generally electricallynon-conductive materials such as most ceramic and polymeric materials.

One of the basic and novel characteristics of implementations ofsemiconductor device packages 2, 56 disclosed herein is the exclusion ofany wire bonds. Another of the basic and novel characteristics ofimplementations of semiconductor device packages 2, 56 disclosed hereinis the exclusion of any leadframe. One of the basic and novelcharacteristics of implementations of a method of forming asemiconductor device package 2, 56 disclosed herein is the exclusion ofa step of including a wire bond in the semiconductor device package 2,56 or otherwise electrically coupling elements of the semiconductordevice package 2, 56 using wire bonds. Another of the basic and novelcharacteristics of implementations of a method of forming asemiconductor device package 2, 56 disclosed herein is the exclusion ofa step of including a leadframe in the semiconductor device package 2,56.

The elimination of wire bonds, interconnects and leadframes from thepackages discussed herein result in a number of beneficial effects, anyone or more of which may exist in packages constructed using the methodsdisclosed herein: reduction cost and build time for the package;reduction of area and height needed for the package on a motherboardand/or within an electronic device; improvement of electricalperformance by eliminating long route paths within the package;provision for a tightly controlled package footprint, and; allowance forconnections typically made in the package through wire bonds, clips andcarriers (such as leadframes) to be made instead on a motherboard.

The distribution layer 82 and package 2/56 in implementations areconfigured so that a majority, or all, of the electrical componentsinternal to the package 2/56 that in prior art packages would beelectrically coupled to one another using wire bonds and/or a leadframeare now electrically coupled to one another via the distribution layer82 of the motherboard 76 without requiring any wire bonds and/or withoutrequiring any leadframe to make the connections. The distribution layer82 and package 2/56 are configured so that a majority, or all, of theelectrical components internal to the package 2/56 that in prior artpackages would be electrically coupled to one another using wire bondsand/or a leadframe are now electrically coupled to one another throughthe distribution layer 82 of the motherboard 76 and one or more clipswithout any wire bonds and without any leadframe. By non-limitingexample the package 2 shown in the drawings is configured so that allbut two of the package 2 interconnects are accomplished through thedistribution layer 82, while the remaining two interconnects areaccomplished using the clips 46, 50. In implementations in which apackage includes more than one die, such as with package 2, thedistribution layer 82 and the package may be configured so that thedistribution layer 82 distributes all inter-die electricalcommunications.

In implementations the methods disclosed herein may be utilized toreduce the size or otherwise modify any existing quad flat no leads(QFN) package or to create a package that may be used in any QFNapplication. In various implementations, conductive solderable contactsare used for all components that are placed onto the adhesive tape 62and all the contacts that are placed down on the adhesive tape 62 arebuilt up to provide sufficient height to allow for a standoff for soldercontact to the motherboard. This standoff, when applicable, may providemold locks, standoff for board mount and component protection.

Implementations of semiconductor device packages, such as package 56shown in FIGS. 12-13, may include a die pad or die flag 84, andimplementations of methods of forming a package 56 may accordinglyinclude mechanically and electrically coupling one or more electricalcontacts on a first face of die 58 (which is on an opposite side of thedie 58 from the second face 60 of the die 58) with the die flag 84. Inother implementations of semiconductor device packages the die flag 84may be omitted, and the method of coupling one or more electricalcontacts on a first face of the die 58 to the die flag 84 mayaccordingly be omitted, such that electrical contacts on a first face ofthe die 58 are instead coupled directly to conductive paths of themotherboard. For purposes of this disclosure the die pad or die flag 84is considered a leadframe. Accordingly, in implementations in which thedie pad or die flag 84 is excluded, the package 56 accordingly includesno leadframe.

In various implementations, a semiconductor device package may includeno die and/or may include one or more passive components such as, bynon-limiting example: resistors; capacitors; inductors; memristors;transducers; sensors; antennas; networks of passive components; andother electrical circuit components. Implementations of semiconductordevice packages which include passive components may be similar or thesame as those shown in the drawings but may include one or more passivecomponents where the one or more die are shown in the drawings.

Implementations of semiconductor packages disclosed herein may utilizeimplementations of a method of forming a semiconductor device package.Implementations of the method include: contacting a plurality ofelectrical contacts on a first face of a passive component with anadhesive of an adhesive surface of an adhesive tape (which may be anydisclosed). The method also include overmolding or encapsulating thepassive component with a mold compound or an encapsulating compoundwhere a portion of the plurality of electrical contacts on the firstface of the passive component are not one of overmolded andencapsulated, forming the semiconductor device package. The overmoldingor encapsulating compound may be any disclosed herein. The semiconductorpackage includes no leadframe. The method also includes removing thesemiconductor device package from the adhesive surface where the portionof the plurality of electrical contacts on the first face of the passivecomponent are positioned to electrically couple with one or moreconductive paths included in a motherboard. As disclosed in thisdocument, the one or more conductive paths form a distribution layerdesigned to distribute all electrical signals between the semiconductordevice package and the motherboard and various components containedthereon. In various implementations such a semiconductor device packageincludes no wire bonds, and it may also include multiple passivecomponents, a mixture of one or more passive components and one or moredie, and/or one or more clips as disclosed herein in relation to otherimplementations.

In places where the description above refers to particularimplementations of semiconductor device packages and related methods andimplementing components, sub-components, methods and sub-methods, itshould be readily apparent that a number of modifications may be madewithout departing from the spirit thereof and that theseimplementations, implementing components, sub-components, methods andsub-methods may be applied to other semiconductor device packages andrelated methods.

What is claimed is:
 1. A method of forming a semiconductor devicepackage, consisting essentially of: contacting a plurality of electricalcontacts on a first face of a first die with an adhesive surface of anadhesive tape; one of overmolding and encapsulating the first die withone of a mold compound and an encapsulating compound, respectively,wherein a portion of the plurality of electrical contacts on the firstface of the first die are not one of overmolded and encapsulated,forming the semiconductor device package; and removing the semiconductordevice package from the adhesive surface; wherein the portion of theplurality of electrical contacts on the first face of the first die arepositioned to electrically couple with one or more conductive pathscomprised in a motherboard, the one or more conductive paths forming adistribution layer; and wherein the distribution layer is configured todistribute all electrical signals between the semiconductor devicepackage and the motherboard; and contacting at least one electricalcontact on a first face of a second die with the adhesive surface;mechanically and electrically coupling a first clip with an electricalcontact on a second face of the second die where the second face of thesecond die is on an opposing side of the second die from the first faceof the second die; contacting an electrical contact of the first clipwith the adhesive surface; and one of overmolding and encapsulating thesecond die and a majority of the first clip with the one of the moldcompound and encapsulating compound, respectively, wherein the at leastone electrical contact on the first face of the second die and theelectrical contact of the first clip are not one of overmolded andencapsulated; wherein the semiconductor device package comprises noleadframe.
 2. The method of claim 1, wherein the first clip is one ofbonded and soldered to the second face of the second die.
 3. The methodof claim 1, wherein the distribution layer is configured to distributeall electrical communications among and between each die, each clip andeach passive component of the semiconductor device package and tofurther interconnect one or more components of the semiconductor devicepackage with one or more components external to the semiconductorpackage through one or more conductive paths of the motherboard.
 4. Themethod of claim 1, further comprising: contacting at least oneelectrical contact on a first face of a third die with the adhesivesurface; mechanically and electrically coupling a second clip with anelectrical contact on a second face of the third die, the second face ofthe third die on an opposing side of the third die from the first faceof the third die; contacting an electrical contact of the second clipwith the adhesive surface; and one of overmolding and encapsulating thethird die and a majority of the second clip with the one of the moldcompound and encapsulating compound, respectively, wherein the at leastone electrical contact on the first face of the third die and theelectrical contact of the second clip are not one of overmolded andencapsulated.
 5. The method of claim 4, wherein the distribution layeris configured to distribute all electrical communications between thefirst die, the second die and the third die.
 6. The method of claim 4,wherein the second clip is positioned to electrically couple the seconddie with the third die through the one or more conductive pathscomprised in the motherboard.
 7. The method of claim 4, wherein theelectrical contact of the second clip is positioned to electricallycouple with the one or more conductive paths comprised in themotherboard.
 8. The method of claim 1, wherein the semiconductor devicepackage comprises no wire bonds.
 9. The method of claim 1, wherein thedistribution layer is configured to distribute a majority of electricalsignals between the plurality of electrical contacts on the first faceof the first die.
 10. The method of claim 1, further comprising couplingthe semiconductor device package with the motherboard.
 11. A method offorming a semiconductor device package, comprising: contacting aplurality of electrical contacts on a first face of one of a first dieand a passive component with an adhesive surface of an adhesive tape;one of overmolding and encapsulating one of the first die and passivecomponent with one of a mold compound and an encapsulating compound,respectively, wherein a portion of the plurality of electrical contactson the first face of one of the first die and passive component are notone of overmolded and encapsulated, forming the semiconductor devicepackage, the semiconductor device package comprising no leadframe; andremoving the semiconductor device package from the adhesive surface;wherein the portion of the plurality of electrical contacts on the firstface of one of the first die and passive component are positioned toelectrically couple with one or more conductive paths comprised in amotherboard, the one or more conductive paths forming a distributionlayer; and wherein the distribution layer is configured to distributeall electrical signals between the semiconductor device package and themotherboard.
 12. The method of claim 11, wherein the semiconductordevice package comprises no wire bonds.
 13. A method of manufacturing asemiconductor device package, consisting essentially of: contacting aplurality of electrical contacts on a first face of a die with anadhesive surface of an adhesive tape; electrically and mechanicallycoupling at least one clip with at least one electrical contact on asecond face of the die, the second face of the die on an opposing sideof the die from the first face of the die, the at least one clipcomprising at least one lead in electrical communication with the atleast one electrical contact on the second face of the die; contactingthe at least one lead with the adhesive surface; one of overmolding andencapsulating the die and a majority of the at least one clip with oneof a mold compound and an encapsulating compound, respectively, whereina portion of the at least one lead and a portion of the plurality ofelectrical contacts on the first face of the die are not one ofovermolded and encapsulated, forming the semiconductor device package;and removing the semiconductor device package from the adhesive surface;wherein the semiconductor device package comprises no leadframe.
 14. Themethod of claim 13, wherein the plurality of electrical contacts on thefirst face of the die comprise one of pads and bumps.
 15. The method ofclaim 13, wherein the semiconductor device package comprises no wirebonds.
 16. The method of claim 13, wherein mechanically coupling the atleast one clip with the at least one electrical contact on the secondface of the die further comprises one of bonding and soldering the atleast one clip with the at least one electrical contact on the secondface of the die.